Bond Rite EZ

The Bond-Rite EZ is a portable, self-testing bond clamp assembly with visual indication, designed for bonding equipment during liquid or powder transfers in locations without installed earthing or bonding systems.

It includes a Bond-Rite clamp with a flashing green LED housed in the clamp, a choice of heavy-duty or medium-duty 2-pole clamps, and flexible cable length options. The LED pulses continuously when the grounding circuit achieves a resistance of 10 ohms or less, and the Bond-Rite EZ continuously monitors the circuit resistance once connected.

FEATURES

A highly visible LED in the grounding clamp confirms when a low-resistance connection is achieved with potentially charged equipment.
Tungsten carbide tips penetrate deposits, rust, and coatings to ensure reliable bonding.
Stainless steel construction ensures durability in harsh chemical processing and industrial environments.
Quick Connect feature enables easy removal from classified areas for battery replacement.
Monitors 10-ohm loop resistance in accordance with international best practice standards.